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Introducing

The World First All-Sided Protection Pane

Level Chip Scale

 

Enhanced & Robust

All sided protection CSP disrupting the WLCSP industry standard market offering.

 

600 mm X 580 mm Panel Packaging

Optimized productivity in semicondctor assembly
Bringing down the packaging cost of the standard Wafer Level CSP
in our exclusive & touch-friendly Nectar Slider.

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Disruptive innovation that bring mobile industry to greater height

Disruptive innovation that brings the mobile industry to greater heights.

Introducing

The World First All-Sided Protection Panel Level Chip Scale

PEP Innovation offers the world first ALL SIDED PROTECTION Chip Scale Package, a high reliability, cost-effective drop-in replacement for existing WLCSP. By virtue of 600 mm X 600 mm Panel level assembly to achieve higher cost efficiency and optimizing material usage, multiple wafers are redistributed with patented precision die placement process, eliminating die shifting problems plaguing the industry. The required circuits are plated and the package encapsulated before singulation to a finished (pin to pin replacement) product

Our mission

“The demands for smaller, lighter packaging solutions whilst keeping sights on high performance in electrical and thermal characteristics have prompted us to push the boundaries of traditional packaging technology in the reduction of cost”

Jimmy ChewChief Executive, PEP Innovation
Cost

Panel assembly for higher productivity and lower minimum order quantity.

Reliability

Qualified manufacturing processes meeting our customers expectation, backed by reliability test data.

Quality Assurance

Highly specialized manufacturing facilities to meet the quality standard expected in the semiconductor industry.

Revolutionizing
the way packaging is done

Thicker dielectric lamination – replacing polymide layer

Thicker RDL Traces for improve current carrying capacity

0.3mm Thin Package – aligning with market trend

Molded compound protection on all sides to reduce backside chipping and handling damage

Cost reduction on Panel level assembly

Thick copper studs protect circuitry from solder electromigration