About Us – PEP

Passion for Innovation

We put emphasis on having

a creative work environment

Manufacturing Facility Chongqing, China

Our Manufacturing Facilities

There are countless reasons why our service is better than the rest, but here you can learn about why we’re different.

Wafer Dielectric lamination

Water Dielectric Lamination

Lorem ipsum dolor sit amet, consectetur adipiscing elit. Donec cursus sapien non enim mollis, nec elementum felis feugiat. Nunc et tristique orci. Morbi feugiat est eget ipsum congue ornare. Pellentesque congue efficitur ante.

Encapsulation

Sputter room

Dry-film lamination/Exposure

Dry-file Lamination/Exposure

Wet process - Plating room

Plating room

Wet process - pre treat

Our Service

Design Services

Our team of engineers are ready to answer to any product design enquiries.

Small lot manufacturing, Fast Turn CSP assembly

PEP innovation panel level packaging allow us to answer to the demands of smaller design houses who are unable to meet the minimum order quantities of larger OSAT. By adopting a no photomask, no plating jig manufacturing process, PEP Innovation is able to offer this package platform for a significantly reduced minimum order quantity. Lot orders as small as 1 panel can be processed. Assembled package can be delivered to the customers in JEDEC trays safely.

Panel Level Assembly

PEP Innovation offers the world first ALL SIDED PROTECTION Chip Scale Package, a high reliability, cost effective drop-in replacement for existing WLCSP. By virtue of 580 mm X 600 mm Panel level assembly to achieve higher cost efficiency and optimizing material usage, multiple wafers are redistributed with patented precision die placement process, eliminating die shifting problems plaguing the industry. The required circuits are plated and the package encapsulated before singulation to a finished (pin to pin replacement) product

PEP Innovation Pte Ltd